Heatsink paste HY-410 (25g, 20ml, -50°C - 180°C)

HY-410 Thermal Paste – Effective Heat Dissipation for Processors and Graphics Cards
HY-410 is a high-quality silver oxide-based thermal paste designed to provide stable cooling for processors, graphics cards, chipsets, and other hot components. It ensures reliable contact between the heatsink surface and the die, reducing temperatures and increasing system performance.
This thermal paste offers the optimal balance of price and performance. It ensures stable cooling, reduces component temperatures, and helps extend the lifespan of your hardware. An excellent choice for both home users and PC builders.

Key Benefits
High thermal conductivity – 4.63 W/m K
Ensures effective heat dissipation even under heavy load.
Universal Application
Suitable for CPUs, GPUs, laptops, game consoles, chipsets, and power modules.
Safe Formula
Non-conductive, eliminating the risk of short circuits. Convenient consistency
Applies easily in a thin, even layer, does not smudge or dry out over time.
Durability
Maintains its properties over a long period of use.

HY-410 Specifications

• Thermal conductivity: 4.63 W/m K
• Electrical conductivity: None
• Color: Silver
• Base: Silver oxide
• Operating temperature: –30°C to +280°C
• Density: 2.5 g/cm³
• Viscosity: 76 Pa s (may vary by batch)
• Consistency: Medium-thickness paste
• Drying resistance: High
• Packaging: 20ml syringe
• Intended use: CPU, GPU, chipsets, laptops, heatsinks, VRM, game consoles