Lead-free solder paste. Ideal for BGA. Easy Print (Sn62Pb36Ag2) 1,4ml

Paste intended for soldering SMD components in production processes that do not include washing phases. Based on a No Clean type flux, it does not require washing, the residues of which do not cause corrosion centers. The product works with all lead-free alloys, it is characterized by good adhesiveness and wettability of the brazed surface. It does not lose its physical and chemical properties even after being left on the PCB for 20 hours. This time depends on the prevailing conditions in the room: humidity and temperature.

- contains a rosin-based flux
- presence of an activator to prevent air bubbles in soldered joints
- these connections have very good mechanical and electrical properties.

If the process includes a washing phase, it can be done with commonly available means (Aqueous PCB cleaner, Alcohol-based PCB cleaner).