Lead-free solder paste BST-506 (SN63/Pb37, 40g., 183 degree)

BST-506 is a high-quality tin-lead solder paste designed for soldering SMD and BGA components. It is widely used in repairing mobile phones, laptops, home appliances and other digital devices.

Composition:
Tin (Sn) — 63%
Lead (Pb) — 37%

This is a classic Sn63/Pb37 formula, providing excellent wettability and reliable connections

• Melting point: about 183°C
• Package weight: 40 g
• Seam color: white, shiny, without defects
• Flux type: active, with good adhesion and transparent residue after soldering

Advantages:

• Excellent wettability and reliability of connections
• High temperature resistance and high adhesion
• Does not form false or cold seams
• Residues after soldering are transparent, do not interfere with visual inspection
• Suitable for precision repair and SMT/BGA soldering
• Paste activity time is up to 48 hours, does not dry out quickly

Application:

• Repair of mobile phones, laptops, boards, microcircuits
• Used in reballing (re-soldering of BGA chips)
• Suitable for manual and automatic soldering