Heatsink paste HPX 100g. (W/mK > 2,8, -50~300 °C)

THERMAL CONDUCTIVE PASTE HPX 100G SILICONE AG THERMOPASTAS

HPX thermal paste with a thermal conductivity coefficient of >2.8W/mK, which does not conduct electricity. It is necessary for the proper operation of all types of temperature sensors. The low thermal impedance of the paste allows it to maintain constant effectiveness at temperatures from -50 to 250 °C.

Application:

• Modules with a high thermal conductivity coefficient,
• Cooling devices on end plates and frames,
• Storage and high speed drives,
• Engine control systems (automotive industry),
• Hard disk and DVD drives,
• power converters,
• high power leds,
• Notebooks and office computers,
• Network communication devices,
• Household appliances, electronic and electrical components,
• Air conditioners.

Physicochemical properties:

• Grey colour
• Thermal conductivity: W/mK > 2.8
• Thermal impedance: °C in2/W < 0.095
• Specific gravity: g/cm³ > 2.15
• Evaporation: 0.001
• Leakage: 0.05
• Dielectric constant: 5.1
• Viscosity: non-flowing
• Thixotropic index: 380+/-10
• Temperature resistance: -50°C ~ 300°C
• Operating temperature: -50°C ~ 250°C