Lead-free solder paste BST-328 (40g., Sn 63%, Pb 37%)

BEST BST-328 solder paste 40g original Sn63 / Pb37 (with lead content) , used for soldering small and hard-to-reach SMD components and replacing balls on BGA systems. Especially recommended and often used for GSM applications. It is used for BGAP screens, thanks to which we obtain the desired mapping of soldering fields to BGA circuits in GSM applications. The paste is also very well suited for precoating BGA pads with lead tin.

Features:

• After applying the paste to soldering points, simply heat it with hot air, infrared or convection to 183C and it turns into tin.
• Does not require cleaning after soldering / flow.
• The paste contains a resin and solvent based flux.