A preparation that removes all soldering residues from the surface of printed circuits and dissolves flux residues (including rosin). The mounted special applicator ensures perfect cleaning and precise access to the surface to be cleaned - it allows you to remove even the smallest dirt without the need to use additional solvent mixtures. PCB plus leaves no residue and evaporates very quickly. Perfect for any electronic service and for PCB cleaning after repair and assembly.

  HEAT SINK COMPOUND (WHITE) 
0.5 g compound 

  HEAT SINK COMPOUND (WHITE) 
25 g compound injection type.

  HEAT SINK COMPOUND (WHITE) 
7g compound 

The paste facilitates heat flow between the electronic components and the heat sink. It is necessary for the proper operation of all types of temperature sensors, protects against atmospheric influences and prevents punctures. It is characterized by very good chemical resistance to oxidation; action of aqueous solutions of acids, bases and salts; sulfur dioxide and ammonia. It has a wide operating temperature range: from -50°C to 200°C.

AG Extreme enables excellent heat conduction between components such as the CPU, GPU, heat sink and fan.
The application method ensures simplicity of use, and the product can be easily applied to various elements of computer equipment and LED diodes

AG Extreme enables excellent heat conduction between components such as the CPU, GPU, heat sink and fan.
The application method ensures simplicity of use, and the product can be easily applied to various elements of computer equipment and LED diodes

AG Gold is a high-quality thermal paste. Due to its 45% gold content, its thermal conductivity is 3 times higher than that of normal thermally conductive pastes. This allows the CPU temperature to drop by about 6 degrees, even without changing the heat sink. The paste is the best alternative for overclockers. The product complies with the ROHS / Hazardous Substances Directive.

AG Gold is a high-quality thermal paste. Due to its 45% gold content, its thermal conductivity is 3 times higher than that of normal thermally conductive pastes. This allows the CPU temperature to drop by about 6 degrees, even without changing the heat sink. The paste is the best alternative for overclockers. The product complies with the ROHS / Hazardous Substances Directive.

AG Silver is a thermal paste with the addition of silver compounds. The thermal conductivity is much higher than that of typical carbon-silicon compounds. The product complies with the ROHS directive.

AG Silver is a thermal paste with the addition of silver compounds. The thermal conductivity is much higher than that of typical carbon-silicon compounds. The product complies with the ROHS directive.

AG THERMALLY CONDUCTIVE SILICONE PASTE HP 100g

HP THERMAL CONDUCTIVE PASTE necessary for the proper operation of all types of temperature sensors. Protects against atmospheric influences and prevents punctures. It is characterized by very good chemical resistance to oxidation, aqueous solutions, acids, alkalis, salts, sulfur dioxide and ammonia. It has a wide operating temperature range.

THERMAL CONDUCTIVE PASTE HPX 100G SILICONE AG THERMOPASTAS

HPX thermal paste with a thermal conductivity coefficient of >2.8W/mK, which does not conduct electricity. It is necessary for the proper operation of all types of temperature sensors. The low thermal impedance of the paste allows it to maintain constant effectiveness at temperatures from -50 to 250 °C.

Insulation tape ELEKTRIX 202 (19mmx20m, black)

Clear varnish 100ml, working temperature: -50 ... 150 ° C

Clear varnish 100ml, working temperature: -50 ... 150 ° C

Clear varnish 50ml , working temperature: -50 ... 150 ° C

silicone paste for insulation 60g