Active Rosin 100g

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

BST-5G Soldering Iron Tips Resurrected Cream

This product can make all kinds of welding head raised.

Electric soldering iron head can't use how long, will be oxidized, the oxidation of the soldering iron head is not easy to welding components, but can only change.

This soldering iron tips resurrected cream can help you bring your soldering iron back to life.

Flux RMA-223

Flux is a soldering gel. Used for soldering BGA chips. Does not contain halogens, has excellent rheological properties. Suitable for lead-free and regular solder profiles. Under temperature conditions, volatile components completely evaporate. Transparent flux residues do not need to be cleaned after soldering. They are used for installing solder balls, when assembling BGA components (reballing). Indispensable when soldering Flip Chip components. Compatible with all PCB surfaces. UV-added flux for screen-printing errors. 

Flux BAKU BK-225 (12g)

Flux BAKU BK-227 (12g)

White solder paste flux BEST BST-223A (15g)

White solder paste flux BST-559A with plunger applicator

White solder paste flux BST-559A (30g)

White solder paste flux BST-559A (50g)

Flux Soldering acid

Flux Soldering Acid (FCC Fluoride)
Flux soldering. It is used for soldering carbon steels, copper, nickel, bronze, steel and their alloys with low-melting solders at a temperature of 150-320C

BEST BST-328 solder paste 40g original Sn63 / Pb37 (with lead content) , used for soldering small and hard-to-reach SMD components and replacing balls on BGA systems. Especially recommended and often used for GSM applications. It is used for BGAP screens, thanks to which we obtain the desired mapping of soldering fields to BGA circuits in GSM applications. The paste is also very well suited for precoating BGA pads with lead tin.

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Paste intended for soldering SMD components in production processes that do not include washing phases. Based on a No Clean type flux, it does not require washing, the residues of which do not cause corrosion centers. The product works with all lead-free alloys, it is characterized by good adhesiveness and wettability of the brazed surface. It does not lose its physical and chemical properties even after being left on the PCB for 20 hours. This time depends on the prevailing conditions in the room: humidity and temperature.

Etching agent for printed circuit boards and copper. The perfect alternative to iron chloride. The agent dissolves very quickly and does not crystallize out of the solution. It etches evenly, ensuring the sharpness of contours and minimizing undercutting.

Rosin "Cynel" 45g

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Rosin 20g

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Rosin 40ml

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Rosin 500g  (pieces)

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Soldering acid 100ml

Soldering acid 35ml

Soldering acid produced by AG Termopasty is a substance that is used when working with nickel-plated surfaces. The bottle contains liquid which should be handled with care. The drug should be applied in small quantities and gradually washed off with water. It contains 35% strong phosphoric acid. If even a drop of AG Termopasty soldering acid gets into your eyes, rinse them immediately with plenty of water and consult a doctor.

Solder paste based on rosin - contains medium-active flux. The paste facilitates soldering of components with elements made of copper, silver, zinc and nickel. Also used for whitening and soldering in the assembly of electronic devices, as well as in radio and communication technology.

Soldering paste 100ml

Working temperature 170-325 ° C

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Cynel-1 paste is produced on the basis of rosin with organic activators. Contains active flux. It is perfect for soldering tinned, copper, brass and nickel surfaces, for whitening the ends of wires, etc. In justified cases, the remnants of the paste can be removed with turpentine.

Working temperature 170-325 ° C

Solder paste is an alloy or pure metal which, when heated, liquefies and melts to flow onto the space between two close fitting parts, creating a soldered joint.

Highly active liquid, intended for soft soldering of galvanized sheets and pure zinc. It enables fast and reliable soldering by good wetting of the joined surfaces. It is used for soldering gutters and roof coverings made of galvanized sheet. It perfectly dissolves oxides and does not damage the surface.

The soldering flux  for SMD AG-5 (100ml)

Liquid, rosin-free, moderately active flux type 2.2.3 A according to ISO 9454-1, which is an alcohol solution of organic compounds. Intended for high-temperature (300-400oC) tinning and soldering of elements coated with polyurethane varnishes and soldering of silver-plated and tin-plated elements.

The soldering flux RF 800 for SMD. A special dropper helps to proportion accurately. It does not need to clean.

The soldering flux RF 800 for SMD. A special dropper helps to proportion accurately. It does not need to clean.

The soldering flux RF 800 for SMD. A special dropper helps to proportion accurately. It does not need to clean.

Rosin-free, liquid, highly active flux type 2.1.2/3 A is an aqueous solution of organic compounds. Designed for soldering SMD components on printed circuit boards.

The soldering flux RF 800 for SMD LP-1 (100ml)

A liquid, chloride-free, moderately active flux, which is an alcoholic solution of organic compounds with a low solids content - 4%. Designed for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. The flux can be applied to the soldered elements using the foam method, flux wave, dipping spray or brush. Residues from this process do not show corrosive effects and do not require disposal.

The soldering flux RF 800 for SMD TK83 -100ml . 

The soldering flux RF 800 for SMD TK83 -50ml . 

The soldering flux  for TS81 -100ml . 

Liquid, rosin-free, highly active fluxes type 3.2.1 A according to ISO 9454-1, being a mixture of inorganic and organic compounds. Designed for soldering elements made of various types of steel (including acid-resistant steel) and elements made of chromin-nickel alloys.